U.S. Patent Office again confirms company’s powerful simulation technology remains unrivaled in its ability as a design tool to predict long term product reliability
Brentwood, TN, November 15, 2012 – The U.S. Patent & Trademark Office recently awarded VEXTEC Corporation its sixth and seventh patents protecting the intellectual property upon which the company’s Virtual Life Management® (VLM®) simulation technology is built. Patent Nos. 8285522 and 8290753, furthers VEXTEC’s ownership stake in probabilistic, microstructure material modeling technology to predict durability. The patents specifically address the use of Virtual Life Management
simulation technology in the design of electronic devices.
The reliability of electronic devices is particularly reliant on the integrity of solder joints and interconnects, which are estimated to account for 70% of the failures in electronic devices. As electronic devices are powered up and down, interconnect elements are subject to thermal gradient cycling, which, working in combination with vibration, impact, and shock loadings, creates dynamic conditions conducive to fatigue in the interconnect and solder joint materials. Dr. Robert Tryon, VEXTEC CTO and Co-founder, whose is a co-inventor, said, “Material failure is considered a primary cause behind electronic device failures. The application of Virtual Life Management modeling techniques provides for improvements in the understanding of electronic system reliability and allow for significant reductions in bench testing.” “These two patents represent another validation point in VEXTEC’s unique computational modeling capabilities and demonstrates the opportunities to accelerate product development and time to market for the electronics industry” according to VEXTEC CEO James Allen. “We look forward to bringing this capability to the global electronics industries.”